Quality control
Quality assurance and counterfeit prevention protocol
Authenticity, condition control, and shipment readiness are checked before release. Ortelvia uses a layered inspection workflow to reduce counterfeit risk, protect traceability, and define when third-party testing should be added.
Policy and scope
Zero tolerance for counterfeit or misrepresented material
The quality program is designed to screen out remarked, resurfaced, refurbished, or mixed-condition components before shipment. It also clarifies what is covered by standard inspection versus special testing on request.
Authenticity red line
No counterfeit, remarked, or degraded material should be represented as new and original. Lots that fail authenticity review are rejected from release.
Lot traceability
Internal lot control, date code review, packaging observations, and supplier background are checked to keep incoming and outgoing material traceable.
Inspection framework
Incoming and pre-shipment checks are aligned to common industry references such as IDEA guidance and relevant MIL-STD-883 methods where applicable.
4-tier workflow
Standard pre-shipment inspection before dispatch
Every batch released from stock or the verified supply network should clear the following four checkpoints. The exact evidence package can vary by order type, package style, and customer requirements.
Level 1
Documentation and packaging verification
- Cross-check manufacturer labels, fonts, bar codes, Data Matrix marks, and lot format against known authentic patterns.
- Inspect factory seal condition, anti-static bags, HIC cards, desiccant status, and security tape where present.
- Align internal lot references with date code, packing date, and available source documentation.
Level 2
High-magnification optical inspection
- Review top marks and body surface under magnification for sanding, acid wash traces, ghost marks, resurfacing, or remarking.
- Inspect leads and plating for oxidation, solder residue, bent pins, re-tinning signs, or abnormal wear.
- Check body corners, mold finish, and package edges for cracks, chip-outs, and other integrity issues.
Level 3
Package dimension and pin coplanarity check
- Measure package dimensions, lead pitch, and pin thickness against official manufacturer drawings where available.
- Check coplanarity and mechanical consistency to identify bent leads, damage from prior handling, or off-spec packaging.
Level 4
Baking, ESD handling, and moisture-safe repacking
- Handle components inside ESD-protected work areas before final release and packing.
- For moisture-sensitive parts, review dry-pack condition and repackage with fresh desiccant and HIC cards when needed.
- Apply vacuum or moisture-barrier secondary packaging based on package sensitivity and shipment route.
Lab escalation
Advanced third-party laboratory services
When programs involve higher reliability requirements, shortage risk, or customer-mandated verification, Ortelvia can coordinate deeper analysis through independent testing laboratories.
Testing module
Purpose and scope
Standard reference
X-ray die and bond wire inspection
Non-destructive review of internal die presence, lead frame layout, and bond wire integrity.
MIL-STD-883 Method 2012
Decapsulation and die marking verification
Chemical decap exposes the die so manufacturer logo, part marking, and die design can be compared against expected authenticity cues.
MIL-STD-883 Method 2018
Solderability testing
Evaluates lead wetting performance to reduce assembly risk caused by oxidation, poor plating, or aged storage condition.
IPC/JEDEC J-STD-002
Release and warranty
Traceability support and quality documentation
Inspection is only useful if the shipment record, commercial alignment, and after-sales process stay consistent. These are the baseline deliverables buyers usually request.
Certificate of Conformance support
COC documentation can be prepared on request to align shipped material, order details, and the stated inspection scope.
30-day quality guarantee
Eligible orders include a 30-day replacement or refund review path for confirmed non-conformance under the agreed commercial terms.
Inspection reporting path
Standard inspection photos, lot observations, and escalated lab reports can be organized according to the verification scope requested before shipment.
Inspection deliverables summary
Visual Inspection Photo Log
Available per batch upon request.
Certificate of Conformance (COC)
Issued by the Ortelvia quality team.
Lab Test Report
Provided when third-party testing is commissioned.
QC FAQ
Common quality questions from procurement teams
Every released batch goes through the four standard checkpoints. Higher-risk projects, shortage buys, or customer specifications may require additional testing.
Need inspection support aligned before placing a PO?
Send the MPN, target quantity, required date code window, and any testing expectation. We can align the verification scope before shipment planning starts.